Slice Detergent Silicon Wafer Cleaning Easily Cleaning Without Heavy Metal / Foam

JH-216 High concentration of two components named Silicon Slice Detergent ​ph≥14 Specific weight 1.15-1.25

1. Brief

This is patent products for degreasing electron level and solar grade silicon slice in IT and solar battery area, and the patent number is ZL200710020269.6. The product contain double group with good performance in emulsion saponifiation edulcoration to tallowvegetable oilmineral oilsoliquiodgrinding past , also in stripingcomplexing edulcoration to metal ion.

2. Key feature

1) double group products with perfect PPR(performance price ratio),Especially suitable for cleaning heavily polluted wafers.

2) be free from calcium, magnesium, metal, copper, lead and phosphor, and meet the requirement of ROHS.

3) low foam, no foam overflow in ultrasonic cleaning and friendly to the environment.

4) good degreasing performance to meet the requirement of high-accuracy IT area in Asian countrys.

3. Technical parameter

4. Instructions

1) put pure water into cleaning tank till three-quarter, then, add agent in 3% -8% concentration, add water till working level, last, heat the bath solution till working temperature.

2) need to change bath solution completely after degreasing certain amount silicon slice.

3) reduce exposed time in air to avoid oxidation.

4) working temperature degree in needed, disposal time: 2-5minutes.

5. Notes

1. The ingot after wire cutting should not be stained with water. If it cannot be cleaned in time, it is best to store it in suspension or cleaning agent (all immersed).

2. Once the wire rod is cut, it must be disposed of immediately. Moreover, the silicon wafer should not be allowed to dry naturally throughout the cleaning process.

3. The silicon wafer must be kept wet when degumming, and it should not be dried naturally.

6. Additions

1) packing:20kg/carton(2kg/bottle),25kg/plastic barrel, 1000kg/barrel

2) validity time: one year