Industrial Silicon Wafer Cleaning Solution Double Group In Concentrate

Industrial Silicon Wafer Cleaning Solution Double Group In Concentrate

To most effectively clean silicon wafers, manufacturers of silicones recommend the following list of cleaning steps:

Step One: Solvent Clean

Semiconductor manufacturing businesses use solvents to successfully remove oils and organic residues from the surface of silicon wafers. While solvents do remove these contaminants, solvents themselves actually leave residue on the surface of wafers as well. For this reason, a two-solvent method is implemented to ensure that the wafer is returned to a contaminant free state. The solvent cleaning method is outlined below:

Prepare two baths, one glass container with acetone and another with methanol.

Place the acetone container on a hot plate to heat the acetone to a temperature of no more than 55°C.

Once warm, soak the silicon wafer in the acetone bath for 10 minutes.

After the acetone bath is complete, remove the silicon wafer and place it into the methanol container for 5 minutes.

Once time is up, remove the wafer from the methanol and rinse in DI water.

Blow dry the silicon wafer with nitrogen.

Step Two: RCA-1 Clean

Those in the semiconductor manufacturing industry then use an RCA clean to remove organic residue. The RCA clean oxidizes the silicon and provides a thin protective layer of oxide to the surface of the wafer. The RCA-1 cleaning method is outlined below:

Begin preparation of an RCA bath by combining 5 parts DI water and 1 part ammonium hydroxide (27%).

Place the RCA container on a hot plate to heat the solution to a temperature of approximately 70°C.

Once this temperature has been reached, remove the container from the hot plate and add 1 part hydrogen peroxide (30%). The solution will bubble after a minute or two.

Once the solution begins to bubble, soak the silicon wafer for approximately 15 minutes.

When time is up, remove the wafer from the RCA bath and place it into a container with DI water, changing the water multiple times to completely rinse the solution.

After this process, remove the wafer from the container under flowing water to ensure that no residue from the water surface sticks to the wafer.

Step Three: Hydrofluoric Acid (HF) Dip

Semiconductor manufacturing businesses then implement the final step, an HF dip, to remove silicon dioxide from the silicon wafer surface. It is important to note that HF is a dangerous chemical, so manufacturers of silicones recommend that protective gear, such as heavy gloves and eye wear, be worn at all times during this step. The HF Dip process is outlined below:

Create an HF dip container by combining 480 ml water with 20 ml HF. Always use a polypropylene beaker as opposed to a glass beaker as HF is known to react dangerously when coming into contact with any glass material.

After creating the solution, soak the silicon wafer for 2 minutes.

Once time is up, remove the wafer and rinse under running DI water.

Perform a wettability test by pouring DI water on the wafer surface. If the water turns into little beads and rolls off, you will know that the surface is hydrophobic and free of oxides.

Blow dry the silicon wafer with nitrogen.

Performing the above steps recommended by manufacturers of silicones will help those businesses in the semiconductor manufacturing industry to overcome the challenges of contamination to silicon wafers.

Silicon Wafer Cleaning Solution  technical parameter

Our Factory

Factory covers an area of 26653 square meters, the construction of a class workshop, C class workshop, C class warehouse, a warehouse and other auxiliary facilities. Involving more than 100 kinds of chemical species. Production capacity of 11000 tons / year.

First, the company production profile

1. C-class workshop
C, 2#, 1# workshop with 3#, 7# four production lines, using the closed production equipment, including 1#, 2#, 3# line by line automation production, and set two fully automatic liquid filling line, filling specifications from 1L~25L can. The ingredients are carried out in a separate sealed area. According to the requirements of the product variety, the central control room of the C-class production line is equipped with all kinds of instruments and sensors to form a plurality of control systems.

2. Class a workshop
Class a workshop with three shaft mixer and high-speed dispersion machine three sets of two, professional to provide all kinds of paint and coating production.

3. C warehouse
C warehouse construction area of more than 3300 square meters and has a fire zone, can be used for the classification of chemical raw materials and finished products.

4. A warehouse
Two warehouse construction area of more than 1400 square meters and has a fire zone, can be used for a, B categories of chemical raw materials and finished products classified storage.

5. Other facilities
The factory has a professional sewage treatment facilities, processing capacity of 20T/d, after the treatment of sewage as reclaimed water for production. The factory is equipped with four sets of waste gas treatment equipment, all the exhaust gas treatment facilities after discharge standards.